DocumentCode
3037158
Title
JTEC panel report on electronic manufacturing and packaging in Japan
Author
Pecht, Michael ; Kelly, Michael ; Boulton, William ; Kukowski, John ; Meieran, Gene ; Peeples, John ; Tummala, Rao
Author_Institution
Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1994
fDate
12-14 Sep 1994
Firstpage
96
Abstract
Global competition in the electronics industry is offering unprecedented challenges to the industrial sector. Product lifecycles are shortening, development cycle times are decreasing, profit margins are declining, and new technology is readily available to anyone who aggressively pursues it. Japan has targeted electronics as an industry vital to its industrial success, and can, to a large degree, declare victory-particularly in the high-volume, low-cost electronic assembly industry. The question that the JTEC Electronic Packaging Panel was asked to answer was, why?
Keywords
economics; electronic equipment manufacture; electronics industry; packaging; product development; production; JTEC panel report; Japan; electronics industry; electronics manufacturing; electronics packaging; global competition; high-volume electronic assembly; low-cost electronic assembly industry; Assembly; Computer displays; Computer peripherals; Consumer electronics; Economic indicators; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Video equipment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404684
Filename
404684
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