Title :
Process control of the lead scanning process [IC packages]
Author :
Kumar, Sanjoy ; Truesdale, Robert
Author_Institution :
Motorola Inc., Oak Hill, TX, USA
Abstract :
The process flow of a scanner was thoroughly looked at. The process flow revealed that accuracy, repeatability, and handling of the parts are the key elements. Through research it was also determined that GR&R and design of experiments were necessary to optimize the scanner parameters. It was also determined that physical handling of the parts created more rejects. Therefore, for performing quality control gates we used full tube or tray quantities to eliminate the human factor. This drove the quality to new highs. There was also automation added to the existing scanners, but before releasing to production the key elements were thoroughly characterized. The SPC charts were also custom-made for the new scanner based on the confidence level of the modified machine. Initially, the frequency was high, but with statistical data, it was eventually back to normal conditions
Keywords :
bending; design of experiments; inspection; integrated circuit manufacture; integrated circuit packaging; quality control; statistical process control; IC package leads; SPC charts; automation; confidence level; design of experiments; lead scanning process; physical handling; process control; production; quality control; statistical data; Assembly; Bonding; Integrated circuit packaging; Integrated circuit testing; Lead; Plastic packaging; Process control; Semiconductor device packaging; Shape; Wire;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404685