• DocumentCode
    3037754
  • Title

    Recent advances in fault isolation for semiconductor industry

  • Author

    Jiann Min Chin ; Narang, V. ; Meng Yeow Tay ; Shei Lay Phoa ; Venkat, Raghu ; Lwin Hnin Ei ; Soon Huat Lim ; Chea Wei Teo ; Zulkifli, Syahirah ; Wen Qiu ; Tan, Jason ; Ranganathan, Gopi ; Zi Ying Oh ; Fang Jie Foo

  • Author_Institution
    Adv. Micro Devices (Singapore) Pte Ltd., Singapore, Singapore
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    269
  • Lastpage
    279
  • Abstract
    In semiconductor companies, failure analysis (FA) activities play a major role in all many areas. FA is deeply involved in new process technology development, 1st Silicon bring-up, wafer sort and backend yield improvement, product qualification and customer return analysis. RegardLeSS Of area that FA SUPPOrtS, there IS aLWaYS a need fOr faULt ISOLatIOn PrIOr tO the PhYSICaL Or deStrUCtIVe faILUre anaLYSIS. FaULt ISOLatIOn IS the SteP Where We narrOW dOWn the area Of a faILIng Part Or PrOdUCt tO a manageabLe area. ThIS aLLOWS FA engIneer tO ImPrOVe the SUCCeSS Of PhYSICaLLY fIndIng rOOt CaUSe Of the faILUre and SPeedS UP the TUrn-arOUnd tIme fOr the anaLYSIS. ThIS InVIted taLK WILL COVer reCent adVanCeS In faULt ISOLatIOn teChnIqUeS and tOOLS In deVICe/SILICOn and PaCKagIng. CaSe StUdIeS fOr thOSe teChnIqUeS WILL be COVered tO PrOVIde greater UnderStandIng fOr the teChnIqUeS tO the aUdIenCe.
  • Keywords
    elemental semiconductors; failure analysis; fault diagnosis; semiconductor device packaging; semiconductor industry; silicon; FA engIneer; Si; customer return analysis; destructive failure analysis; failure analysis; fault isolation; physical analysis; process technology development; semiconductor companies; semiconductor industry; wafer sort; Circuit faults; Detectors; Failure analysis; Integrated circuits; Reflectometry; Spatial resolution; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599166
  • Filename
    6599166