DocumentCode
3037892
Title
On clustering of defects and yield of SMT assemblies
Author
Tegethoff, Mick M V ; Chen, Tom W.
Author_Institution
Hewlett-Packard Co., Fort Collins, CO, USA
fYear
1994
fDate
12-14 Sep 1994
Firstpage
75
Abstract
This paper describes a clustered yield model for complex Surface Mount Technology (SMT) assemblies. The model uses the negative binomial distribution of defects to calculate board yield after test. Manufacturing data validates that this model accurately predicts the clustering of defects and the yield predictions are significantly better than traditional binomial models
Keywords
binomial distribution; design for manufacture; design for testability; modelling; printed circuit manufacture; surface mount technology; SMT assemblies; board yield; clustered yield model; defects clustering; negative binomial distribution; surface mount technology; yield prediction; Assembly; Circuit faults; Design for manufacture; Integrated circuit yield; Predictive models; Production; Surface-mount technology; Testing; Virtual manufacturing; Yield estimation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location
La Jolla, CA
Print_ISBN
0-7803-2037-9
Type
conf
DOI
10.1109/IEMT.1994.404688
Filename
404688
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