DocumentCode :
3037964
Title :
Superior NBTI reliability of SiGe channel pMOSFETs: Replacement gate, FinFETs, and impact of Body Bias
Author :
Franco, J. ; Kaczer, B. ; Eneman, G. ; Roussel, Ph J. ; Grasser, T. ; Mitard, J. ; Ragnarsson, L. -Å ; Cho, M. ; Witters, L. ; Chiarella, T. ; Togo, M. ; Wang, W.-E. ; Hikavyy, A. ; Loo, R. ; Horiguchi, N. ; Groeseneken, G.
Author_Institution :
ESAT Dept., Katholieke Univ. Leuven, Leuven, Belgium
fYear :
2011
fDate :
5-7 Dec. 2011
Abstract :
In this paper we demonstrate superior NBTI reliability of SiGe pFETs with ultra-thin EOT in a Replacement Metal Gate (RMG) process flow, and in a SiGe channel bulk pFinFET architecture. Moreover, we investigate the Forward Body Bias (FBB) technique showing that it can very efficiently improve the SiGe device ION without compromising the NBTI reliability, or vice versa further improve the device reliability without compromising the ION. Based on the insights provided by the Body Bias experiments, we propose a model for the superior SiGe NBTI reliability which can explain all the experimental observations.
Keywords :
Ge-Si alloys; MOSFET; semiconductor device reliability; NBTI reliability; SiGe; channel bulk pFinFET architecture; channel pMOSFET; device reliability improvement; forward body bias technique; negative bias temperature instability; replacement metal gate process flow; ultra-thin EOT; Logic gates; Metals; Performance evaluation; Reliability; Silicon; Silicon germanium; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Print_ISBN :
978-1-4577-0506-9
Electronic_ISBN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.2011.6131580
Filename :
6131580
Link To Document :
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