An unique method to fabricate on-chip capacitors for chip-level EMC evaluation

Author

Sheng-Yu Chen ; Siao, Vicky

Author_Institution

Integrated Service Technol., Hsinchu, Taiwan

fYear

2013

fDate

15-19 July 2013

Firstpage

366

Lastpage

369

Abstract

In this work, we proposed an unique method to fabricate on-chip capacitors connected to IC inner circuits by the application of focused ion beam (FIB) techniques. It is a convenient and cost-saving way to verify the chip-level electromagnetic compatibility (EMC) performance. The effect of the FIB-fabricated on-chip decoupling capacitor on improving electromagnetic interference (EMI) performance was also shown in the present study, based on the results of the transverse electromagnetic transmission (TEM) cell and surface scan measurements.

Keywords

TEM cells; capacitors; electromagnetic compatibility; electromagnetic interference; focused ion beam technology; monolithic integrated circuits; EMI performance; FIB-fabricated on-chip decoupling capacitor; IC inner circuits; TEM cell; chip-level EMC evaluation; chip-level EMC performance; chip-level electromagnetic compatibility performance; electromagnetic interference; focused ion beam technique; on-chip capacitor fabrication; surface scan measurement; transverse electromagnetic transmission cell; Capacitors; Electromagnetic compatibility; Electromagnetic interference; Electromagnetics; Integrated circuit modeling; System-on-chip; EMC/EMI; FIB; circuit edit;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the

Conference_Location

Suzhou

ISSN

1946-1542

Print_ISBN

978-1-4799-1241-4

Type

conf

DOI

10.1109/IPFA.2013.6599183

Filename

6599183