Title :
An unique method to fabricate on-chip capacitors for chip-level EMC evaluation
Author :
Sheng-Yu Chen ; Siao, Vicky
Author_Institution :
Integrated Service Technol., Hsinchu, Taiwan
Abstract :
In this work, we proposed an unique method to fabricate on-chip capacitors connected to IC inner circuits by the application of focused ion beam (FIB) techniques. It is a convenient and cost-saving way to verify the chip-level electromagnetic compatibility (EMC) performance. The effect of the FIB-fabricated on-chip decoupling capacitor on improving electromagnetic interference (EMI) performance was also shown in the present study, based on the results of the transverse electromagnetic transmission (TEM) cell and surface scan measurements.
Keywords :
TEM cells; capacitors; electromagnetic compatibility; electromagnetic interference; focused ion beam technology; monolithic integrated circuits; EMI performance; FIB-fabricated on-chip decoupling capacitor; IC inner circuits; TEM cell; chip-level EMC evaluation; chip-level EMC performance; chip-level electromagnetic compatibility performance; electromagnetic interference; focused ion beam technique; on-chip capacitor fabrication; surface scan measurement; transverse electromagnetic transmission cell; Capacitors; Electromagnetic compatibility; Electromagnetic interference; Electromagnetics; Integrated circuit modeling; System-on-chip; EMC/EMI; FIB; circuit edit;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599183
