Title :
MEMS technology using back-end of line processes in CMOS LSI
Author :
Machida, Shuntaro
Author_Institution :
Central Res. Lab., Hitachi, Ltd., Tokyo, Japan
Abstract :
Microelectromechanical systems (MEMS) technology using “back-end of line” (BEOL) processes for CMOS LSIs (called “BEOL-MEMS” technology hereafter) was developed. BEOL-MEMS makes it possible to monolithically integrate MEMS with LSIs. A pressure sensor is successfully integrated with a CMOS LSI, which shows good mechanical reliability and high output-voltage stability. To demonstrate the potential of this technology, a motion sensor and a pressure sensor were simultaneously fabricated on a single chip. A capacitive micromachined ultrasonic transducer based on BEOL-MEMS driven by high voltage (over 100 V) was also fabricated.
Keywords :
CMOS integrated circuits; integrated circuit reliability; large scale integration; micromechanical devices; microsensors; pressure sensors; ultrasonic transducers; BEOL-MEMS technology; CMOS LSI; MEMS technology; capacitive micromachined ultrasonic transducer; high output-voltage stability; line processes; mechanical reliability; microelectromechanical systems technology; motion sensor; pressure sensor; CMOS process; CMOS technology; Circuits; Dielectric materials; Electrodes; Etching; Large scale integration; Mechanical sensors; Micromechanical devices; Voltage;
Conference_Titel :
Interconnect Technology Conference (IITC), 2010 International
Conference_Location :
Burlingame, CA
Print_ISBN :
978-1-4244-7676-3
DOI :
10.1109/IITC.2010.5510691
