DocumentCode
3038265
Title
ISTFA best paper: FemtoFarad/TeraOhm endpoint detection for microsurgery of integrated circuit devices
Author
Colvin, Jim
Author_Institution
FA Instrum., Inc., San Jose, CA, USA
fYear
2013
fDate
15-19 July 2013
Firstpage
415
Lastpage
422
Abstract
Interactive electrical endpoint detection when thinning conductive and capacitive materials opens the door to approaching a suspect site in an IC without relying on the traditional iterative approach. Controlled approach of embedded conductors in insulators (packages) as well as controlled die thinning with submicron control will be shown, allowing safe approach to the desired feature without overshoot.
Keywords
capacitors; conductors (electric); insulators; integrated circuit packaging; IC; ISTFA; capacitive material thinning; conductive material thinning; controlled die thinning; embedded conductor; femtofarad-teraohm endpoint detection; insulator; integrated circuit device; interactive electrical endpoint detection; iterative approach; microsurgery; packaging; submicron control; Capacitance; Cavity resonators; Integrated circuits; Milling; Plastics; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location
Suzhou
ISSN
1946-1542
Print_ISBN
978-1-4799-1241-4
Type
conf
DOI
10.1109/IPFA.2013.6599192
Filename
6599192
Link To Document