Title :
Three-dimensional characterization of crystalline grains in sub-100 nm Cu lines by Transmission Electron Microtomography
Author :
Ito, Toshihiko ; Matsuwaki, Ukyo ; Naijou, Takanori ; Hashimoto, Hideki ; Tarumi, Nobuaki ; Ogawa, Shinichi
Author_Institution :
Toray Res. Center, Inc., Otsu, Japan
Abstract :
The high resolution Transmission Electron Microtomography (TEMT) for characterization of grains in a Cu sub-100nm line was firstly reported. A new sample preparation method was developed for obtaining TEM projections from the tilted sample from -90 to +90 degrees. A Cu grain structure was become clear by the 3D TEMT. Furthermore grooving at the surface and micro voids of a few nm were found at the grain boundaries.
Keywords :
integrated circuit interconnections; tomography; transmission electron microscopy; 3D TEMT; Cu; Cu grain structure; Cu lines; crystalline grains; high resolution transmission electron microtomography; three-dimensional characterization; Acceleration; Computed tomography; Crystallization; Diffraction; Grain boundaries; Grain size; Image reconstruction; Image resolution; Shape; Transmission electron microscopy;
Conference_Titel :
Interconnect Technology Conference (IITC), 2010 International
Conference_Location :
Burlingame, CA
Print_ISBN :
978-1-4244-7676-3
DOI :
10.1109/IITC.2010.5510697
