• DocumentCode
    3038688
  • Title

    A novel optical structure of numerical aperture increasing lens (NAIL) for resolution improvement in backside failure analysis

  • Author

    Li Tian ; Kuibo Lan ; Gaojie Wen ; Miao Wu ; Chunlei Wu ; Diwei Fan ; Dong Wang

  • Author_Institution
    Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    501
  • Lastpage
    503
  • Abstract
    As the development of VLSI and scaling down & multi-metal-layer of semiconductor devices, there was the obstacle for failure analysis (FA) from front side of device. So, FA from backside was developed in microelectronics yield in recent years. As is known to all, we could capture clearer infrared (IR) image from backside as Si substrate was thinner. But if we needed higher resolution image with conventional optical objective lens, we must introduced NAIL or shorter wavelength light to improve numerical aperture (NA) in objective space. In this paper, we proposed one novel optical structure of NAIL to enlarge aperture angle in objective space to obtain larger NA value and higher resolution. We introduced the principle of NAIL, designed our optical structure, and analyzed its characteristic. Its advantages were that (1) the variable refractive index of liquid material and liquid made light scattering decreased, (2) common solid body material-glass which made fabrication process simply due to its larger size. So, we believed the novel optical structure was beneficial to our FA from backside.
  • Keywords
    failure analysis; lenses; refractive index; semiconductor device reliability; semiconductor device testing; NAIL; Si substrate; VLSI; backside failure analysis resolution improvement; light scattering; liquid material; numerical aperture increasing lens; optical structure; refractive index; Failure analysis; Integrated circuits; Microscopy; Nails; Optical device fabrication; Optical imaging; Physics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599210
  • Filename
    6599210