DocumentCode
3038688
Title
A novel optical structure of numerical aperture increasing lens (NAIL) for resolution improvement in backside failure analysis
Author
Li Tian ; Kuibo Lan ; Gaojie Wen ; Miao Wu ; Chunlei Wu ; Diwei Fan ; Dong Wang
Author_Institution
Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2013
fDate
15-19 July 2013
Firstpage
501
Lastpage
503
Abstract
As the development of VLSI and scaling down & multi-metal-layer of semiconductor devices, there was the obstacle for failure analysis (FA) from front side of device. So, FA from backside was developed in microelectronics yield in recent years. As is known to all, we could capture clearer infrared (IR) image from backside as Si substrate was thinner. But if we needed higher resolution image with conventional optical objective lens, we must introduced NAIL or shorter wavelength light to improve numerical aperture (NA) in objective space. In this paper, we proposed one novel optical structure of NAIL to enlarge aperture angle in objective space to obtain larger NA value and higher resolution. We introduced the principle of NAIL, designed our optical structure, and analyzed its characteristic. Its advantages were that (1) the variable refractive index of liquid material and liquid made light scattering decreased, (2) common solid body material-glass which made fabrication process simply due to its larger size. So, we believed the novel optical structure was beneficial to our FA from backside.
Keywords
failure analysis; lenses; refractive index; semiconductor device reliability; semiconductor device testing; NAIL; Si substrate; VLSI; backside failure analysis resolution improvement; light scattering; liquid material; numerical aperture increasing lens; optical structure; refractive index; Failure analysis; Integrated circuits; Microscopy; Nails; Optical device fabrication; Optical imaging; Physics;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location
Suzhou
ISSN
1946-1542
Print_ISBN
978-1-4799-1241-4
Type
conf
DOI
10.1109/IPFA.2013.6599210
Filename
6599210
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