DocumentCode :
3038795
Title :
Drain current variability and MOSFET parameters correlations in planar FDSOI technology
Author :
Mazurier, J. ; Weber, O. ; Andrieu, F. ; Allain, F. ; Tosti, L. ; Brévard, L. ; Rozeau, O. ; Jaud, M.-A. ; Perreau, P. ; Fenouillet-Beranger, C. ; Khaja, F.A. ; Colombeau, B. ; De Cock, G. ; Ghibaudo, G. ; Belleville, M. ; Faynot, O. ; Poiroux, T.
Author_Institution :
DCOS Dept., CEA, Grenoble, France
fYear :
2011
fDate :
5-7 Dec. 2011
Abstract :
We present for the first time an extensive experimental study of the statistical variability of the drain current (ID) in 6nm thin undoped Silicon-On-Insulator (SOI) MOSFETs. ID variations (σID) are found to be highly correlated with both threshold voltage (VT) and ON-state resistance (RON) fluctuations. Their respective contributions cannot be directly added to capture σID because of an advantageous ΔVT/ΔRON correlation. Taking into account such correlations is of great interest for an accurate definition of spice model corners. We also evidence the main technological sources of ID fluctuation. Improving the access resistances (RSD) enables to lowering the RON variability. Engineering of the source/drain implantations (Low temperature C+P co-implant) mainly reduces the current (ISAT, IOFF) variability through an improved VT control.
Keywords :
MOSFET; elemental semiconductors; silicon; silicon-on-insulator; MOSFET parameter correlation; SPICE model accurate definition; Si; drain current statistical variability; on-state resistance fluctuation; planar FDSOI technology; planar fully-depleted silicon-on-insulator technology; size 6 nm; source-rain implantation; threshold voltage; undoped SOI MOSFET; undoped silicon-on-insulator MOSFET; Correlation; Fluctuations; Junctions; Logic gates; MOSFETs; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location :
Washington, DC
ISSN :
0163-1918
Print_ISBN :
978-1-4577-0506-9
Electronic_ISBN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.2011.6131613
Filename :
6131613
Link To Document :
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