• DocumentCode
    3038834
  • Title

    Electrical fault isolation of intermittent frequency-dependent BRAM functional failure using fast frequency initialized read-only test and failure pattern commonality analysis

  • Author

    Yeoh Karkeong ; Chew Su Fang

  • Author_Institution
    Xilinx Asia Pacific Pte Ltd., Singapore, Singapore
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    526
  • Lastpage
    530
  • Abstract
    Block Random Access Memory (BRAM) is a dedicated 18K/36Kbits hard logic configurable memory module embedded in Field Programmable Gate Array (FPGA) devices. BRAMs can be inferred as First In, First Out (FIFO) buffers, single or dual port, and cascading memory blocks accessed via by-1, 2, 4, 9,18, and 36 modes. Physical failure analysis (PFA) of intermittent read and write failures evident only at fast frequency mode due to void-like metal defect in 36K(36,864 bits) BRAM block is very difficult and complex. Conventional PFA techniques such as OBIRCH and photon emission analysis cannot be used to localize the failure because of frequency dependency and intermittency of failure. Nano-probing each metal trace is almost impossible for an extremely wide area of memory array. This paper will discuss the fast-frequency, initialized read-only diagnostic and failing signature commonality analysis technique and how it was utilized to quantify and localize the defect of an intermittent BRAM failure. A metal-void defect was found as an evidence of this intermittent failure electrically fault isolated by the technique described in this paper.
  • Keywords
    failure analysis; field programmable gate arrays; integrated circuit reliability; integrated circuit testing; logic circuits; random-access storage; BRAM block; FIFO buffers; FPGA devices; OBIRCH; PFA technique; block random access memory; dual port; electrical fault isolation; failure pattern commonality analysis; fast frequency initialized read-only test; field programmable gate array; first-in first-out buffers; hard logic configurable memory module; intermittent frequency-dependent BRAM functional failure; intermittent read-write failures; memory array; metal-void defect; nanoprobing; photon emission analysis; physical failure analysis; single port; void-like metal defect; Decision support systems; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599216
  • Filename
    6599216