• DocumentCode
    3038933
  • Title

    Molecular design of ultra-low-k hybrid glasses

  • Author

    Oliver, Mark ; Dubois, Geraud ; Dauskardt, Reinhold

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • fDate
    6-9 June 2010
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Bridged organosilicates have recently emerged as potential ultra-low-k (ULK) candidates for the 32 nm technology node and beyond due to their superior mechanical properties. While the organic bridge provides enhanced network connectivity, the presence of terminal Si-Me groups has the opposite effect. Predicting the influence of the precursor structure and network connectivity on resulting material mechanical properties would be of tremendous interest to the semiconductor industry. Toward that goal, we have developed computational tools to generate highly accurate molecular models of a broad range of ULK organosilicates and make quantitative predictions about both their elastic and fracture properties (Fig 1). Here we demonstrate the enormous potential of these models for guiding the molecular design of new ULK materials to enable reliable integration in the future technology nodes.
  • Keywords
    low-k dielectric thin films; mechanical properties; porous materials; bridged organosilicates; elastic properties; enhanced network connectivity; fracture properties; material mechanical properties; molecular design; porous materials; semiconductor industry; size 32 nm; ultra-low-k hybrid glasses; Bridges; Design engineering; Glass; Materials reliability; Materials science and technology; Mechanical factors; Organic materials; Predictive models; Silicon; Solid state circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference (IITC), 2010 International
  • Conference_Location
    Burlingame, CA
  • Print_ISBN
    978-1-4244-7676-3
  • Type

    conf

  • DOI
    10.1109/IITC.2010.5510740
  • Filename
    5510740