DocumentCode
3038933
Title
Molecular design of ultra-low-k hybrid glasses
Author
Oliver, Mark ; Dubois, Geraud ; Dauskardt, Reinhold
Author_Institution
Dept. of Mater. Sci. & Eng., Stanford Univ., Stanford, CA, USA
fYear
2010
fDate
6-9 June 2010
Firstpage
1
Lastpage
3
Abstract
Bridged organosilicates have recently emerged as potential ultra-low-k (ULK) candidates for the 32 nm technology node and beyond due to their superior mechanical properties. While the organic bridge provides enhanced network connectivity, the presence of terminal Si-Me groups has the opposite effect. Predicting the influence of the precursor structure and network connectivity on resulting material mechanical properties would be of tremendous interest to the semiconductor industry. Toward that goal, we have developed computational tools to generate highly accurate molecular models of a broad range of ULK organosilicates and make quantitative predictions about both their elastic and fracture properties (Fig 1). Here we demonstrate the enormous potential of these models for guiding the molecular design of new ULK materials to enable reliable integration in the future technology nodes.
Keywords
low-k dielectric thin films; mechanical properties; porous materials; bridged organosilicates; elastic properties; enhanced network connectivity; fracture properties; material mechanical properties; molecular design; porous materials; semiconductor industry; size 32 nm; ultra-low-k hybrid glasses; Bridges; Design engineering; Glass; Materials reliability; Materials science and technology; Mechanical factors; Organic materials; Predictive models; Silicon; Solid state circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference (IITC), 2010 International
Conference_Location
Burlingame, CA
Print_ISBN
978-1-4244-7676-3
Type
conf
DOI
10.1109/IITC.2010.5510740
Filename
5510740
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