New capability of laser ablation in failure analysis

Author

Liew, C.N. ; Khoo, K.L. ; Tiang, L.S. ; Ng, Y.J.

Author_Institution

Altera Corp. (M), Medan Bayan Lepas, Malaysia

fYear

2013

fDate

15-19 July 2013

Firstpage

550

Lastpage

555

Abstract

Uniformity and planarity are always a challenge and be co me more important in package-level failure analysis with the increase in substrate´s complexity. This work highlights novel approach of substrate de-layering by extending laser ablation capability to achieve greatly enhanced de-layering quality and better efficiency relatively to conventional manual lapping methodology.

Keywords

failure analysis; laser ablation; laser ablation capability; manual lapping methodology; package-level failure analysis; planarity; substrate de-layering; uniformity; DH-HEMTs; Decision support systems; Failure analysis; Integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the

Conference_Location

Suzhou

ISSN

1946-1542

Print_ISBN

978-1-4799-1241-4

Type

conf

DOI

10.1109/IPFA.2013.6599221

Filename

6599221

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3038970