Development of failure analysis technique for temperature dependent failures

The growing demand for semiconductor products especially in the field of automotive industry calls for products that can withstand applications over wide range of temperature. Detailed design, robust reliability program and effective tri-temperature screening are some factors that need to be taken in consideration before a product can be introduced in the market. On the other hand, readiness in after sales support like Failure Analysis is also an important aspect that needs to be considered. Temperature dependent failures pose a challenge in the field of failure analysis. The need to simulate the failure at hot or cold conditions and integrating this failure condition in the failure isolation process and succeeding analysis steps to determine the failure mechanism is necessary.