Title :
Cu - based catalysts can make CMOS compatible Si nanowires: Toward reconfigurable interconnects
Author :
Jousseaume, V. ; Renard, V.T.
Author_Institution :
LETI-Minatec, CEA, Grenoble, France
Abstract :
CMOS compatible nanowires provide an interesting opportunity to integrate logic functions in interconnects levels. We report here the development of a method to grow silicon nanowire using back-end-of-line compatible copper-based catalysts. Our approach is based on oxidation of copper prior to growth and allows reducing silicon nanowire synthesis temperature below 450°C, a Back-end-of-line compatible temperature range. New functionalities permitted by silicon nanowires may therefore be added to interconnection levels.
Keywords :
CMOS integrated circuits; copper; integrated circuit interconnections; nanowires; silicon; CMOS compatible nanowires; Cu; interconnection levels; logic functions; reconfigurable interconnects; silicon nanowire synthesis; Chemical vapor deposition; Copper; Fabrication; Gold; III-V semiconductor materials; Logic functions; Nanowires; Semiconductor diodes; Silicon; Temperature distribution;
Conference_Titel :
Interconnect Technology Conference (IITC), 2010 International
Conference_Location :
Burlingame, CA
Print_ISBN :
978-1-4244-7676-3
DOI :
10.1109/IITC.2010.5510748