• DocumentCode
    3039346
  • Title

    Modeling and Analysis of Leakage Induced Damping Effect in Low Voltage LSIs

  • Author

    Gu, Jie ; Keane, John ; Kim, Chris

  • Author_Institution
    Minnesota Univ., Minneapolis, MN
  • fYear
    2006
  • fDate
    4-6 Oct. 2006
  • Firstpage
    382
  • Lastpage
    387
  • Abstract
    Although there has been extensive research on controlling leakage power, the fact that leaky transistors can act as a damping element for supply noise has been long ignored or unnoticed in the design community. This paper investigates the leakage induced damping effect that helps suppress the supply noise. By developing physics-based impedance models for active and leakage currents, we show that leakage, particularly gate tunneling leakage, provides more damping than strong-inversion current. Simulations were performed in a 32nm CMOS technology to validate our models under PVT variations and to explore the voltage dependent behavior of this phenomenon. Design example utilizing leakage induced damping such as decap assignment is discussed with results showing 15.6% saving in decap area
  • Keywords
    CMOS integrated circuits; VLSI; circuit simulation; damping; integrated circuit design; leakage currents; low-power electronics; tunnelling; 32 nm; CMOS technology; PVT variations; active currents; circuit simulations; decap assignment; gate tunneling leakage; leakage current; leakage induced damping effect; leakage power control; leaky transistors; low voltage LSI; physics-based impedance models; supply noise suppression; CMOS technology; Circuit noise; Damping; Gate leakage; Leakage current; Low voltage; Resistors; Resonance; Semiconductor device modeling; Semiconductor device noise; Damping effect; Design; Management; Performance; gate leakage; subthreshold leakage; supply noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design, 2006. ISLPED'06. Proceedings of the 2006 International Symposium on
  • Conference_Location
    Tegernsee
  • Print_ISBN
    1-59593-462-6
  • Type

    conf

  • DOI
    10.1109/LPE.2006.4271873
  • Filename
    4271873