Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications

Author

Shangguan, Dongkai ; Achari, Achyuta

Author_Institution

Div. of Electron., Ford Motor Co., Dearborn, MI, USA

fYear

1994

fDate

12-14 Sep 1994

Firstpage

25

Abstract

This paper presents the evaluation results on the lead-free eutectic Sn-Ag solder for use in automotive electronics packaging applications. The major areas of study are the metallurgical interactions between the solder, the conductor, and the component termination, and their impact on reliability. Studies have been conducted with the eutectic Sn/Pb solder as a control group for comparison

Keywords

adhesion; automotive electronics; circuit reliability; eutectic alloys; integrated circuit packaging; integrated circuit reliability; metallurgy; packaging; printed circuits; reflow soldering; silver alloys; thick film circuits; tin alloys; PWB; SnAg; adhesion; automotive electronics packaging; component termination interaction; conductor interaction; eutectic Sn-Ag solder; metallurgical interactions; reflow; reliability; thick film; Aging; Automotive electronics; Bonding; Conducting materials; Conductors; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Substrates; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International

Conference_Location

La Jolla, CA

Print_ISBN

0-7803-2037-9

Type

conf

DOI

10.1109/IEMT.1994.404695

Filename

404695