Title :
Directly Modulated Laser Intrinsic Parameters Optimization for WDM Systems
Author :
Campos, Carmina Del Río ; Horche, Paloma R.
Author_Institution :
Dipt. de Sist. de Inf. y Comun., Univ. San Pablo CEU, Madrid
fDate :
Sept. 29 2008-Oct. 4 2008
Abstract :
Direct modulation schemes have involved increased attention during the past few years because of their intrinsic simplicity and cost-effectiveness, especially when applied to WDM metro and access networks. However, the output power waveform from a directly modulated laser is not an exact replica of the current modulation and its instantaneous optical frequency varies with time depending on the changes in the optical power (an effect also known as frequency chirp). In this work, using an Optical Communication System Design Software, we studied a directly modulated WDM 2.5 Gb/s system. We have demonstrated that transmission performance depends strongly on DML characteristics. Furthermore, simulation results provided further details about the effects of DML type (adiabatic or transient chirp dominated) as well as the effects of the optical output power. These details can provide useful design guidelines for the design of a WDM metro network.
Keywords :
modulation; optical communication; optimisation; wavelength division multiplexing; WDM systems; direct modulation; directly modulated laser; laser intrinsic parameters optimization; optical communication system design software; power waveform; Chirp modulation; Communication system software; Frequency; Laser transitions; Optical fiber communication; Optical modulation; Power generation; Power lasers; Software systems; Wavelength division multiplexing; Directly modulated laser; adiabatic chirp coefficient; computer simulation; frequency chirp; intrinsic linewidth enhancement factor; wavelength division multiplexing WDM;
Conference_Titel :
Advances in Electronics and Micro-electronics, 2008. ENICS '08. International Conference on
Conference_Location :
Valencia
Print_ISBN :
978-0-7695-3370-4
Electronic_ISBN :
978-0-7695-3370-4
DOI :
10.1109/ENICS.2008.25