AT&T lead-free solder paste for the cost effective manufacture of flip-chip silicon-on-silicon MCM

The development and implementation of a lead-free solder based Multichip Module (MCM) tile assembly technology called AT&T micro-Surface Mount Technology or AT&T μSMT is described. This novel technology exploits a unique Sn/Sb solder paste, batch processing and high speed automated flip-chip assembly to achieve high through-put and yield. As a result it is now possible to manufacture highly integrated MCM products in the numbers required to assure a competitive cost by permitting the distribution of capital expenses over a large production volume, and to do so without compromising their inherent advantages in performance and (small) size