Title :
Effects of temperatures above the glass transition on properties of plastic encapsulant materials
Author :
Lowry, R.K. ; Hanley, K. ; Berriche, R.
Author_Institution :
Intersil Corp, Melbourne, FL, USA
Abstract :
The effects of time and temperature on four mold compounds with T g values in the range 145-190°C were studied. The selected plastics were heated at temperatures ranging from 25°C to more than 100°C above Tg, for times ranging from 24 hours to as much as 1500 hours. The materials were then analyzed for the effects of heating on Tg, coefficients of thermal expansion, volatilized substances, and surface physical, chemical and mechanical changes. Considerable degradation in the properties of the mold compounds was observed to take place. For instance, there was clearly a change in the physical appearance of the parts and changes in Tg values and surface hardness. As expected, the extent of degradation depended strongly on exposure temperature and time. While this study did not include electrical function, changes observed in the plastics indicate that, as a general rule, PEMs should not be exposed to temperatures greater than Tg for significant lengths of time
Keywords :
encapsulation; environmental degradation; glass transition; hardness; heat treatment; integrated circuit packaging; moulding; plastic packaging; thermal expansion; 145 to 190 C; 24 to 1500 hr; PEMs; coefficient of thermal expansion; electrical function; exposure temperature; exposure time effects; glass transition; heating effects; mold compound properties degradation; mold compounds; physical appearance; plastic encapsulant materials; plastics heating temperatures; surface chemical change; surface hardness; surface mechanical change; surface physical change; temperature effects; volatilized substances; Assembly; Chemical analysis; Control charts; Degradation; Glass; Heating; Plastics; Resins; Temperature distribution; Thermal expansion;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916549