Spherical silicon 1 mm device and its clustering

Author

Takeda, Nobuo

Author_Institution

Ball Semicond. Inc., Allen, TX, USA

fYear

2001

fDate

2001

Firstpage

86

Lastpage

91

Abstract

Instead of using conventional flat and rectangular chip technology, the paper proposes fabrication of semiconductor devices and sensors on 1 mm-diameter spherical silicon (Ball) substrates. This paper describes five key enabling process technologies to realize Ball products such as integrated circuits and 3-axis accelerometers, including a clustering technology to connect Ball devices together like the atoms of a molecule

Keywords

accelerometers; electric sensing devices; elemental semiconductors; integrated circuit technology; semiconductor technology; silicon; 1 mm; Ball device interconnection; Ball products; Si; clustering technology; enabling process technologies; flat rectangular chip technology; integrated circuits; semiconductor device fabrication; semiconductor devices; semiconductor sensors; spherical silicon Ball substrates; spherical silicon device; spherical silicon device clustering; three-axis accelerometers; Chemical technology; Crystallization; Fabrication; Integrated circuit technology; Lapping; Plasma materials processing; Plasma temperature; Semiconductor device manufacture; Shape; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916554

Filename

916554