Rubber stamped plastic circuits for electronic paper

Author

Rogers, John A. ; Baldwin, Kirk ; Bao, Zhenan ; Dodabalapur, Ananth ; Raju, V.R. ; Ewing, Jay ; Amundson, Karl

Author_Institution

AT&T Bell Labs., Murray Hill, NJ, USA

fYear

2001

fDate

2001

Firstpage

98

Lastpage

103

Abstract

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (μCP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (~1 μm) of the printed elements, the large area coverage (~1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics

Keywords

display devices; electrophoresis; integrated circuit technology; molecular electronics; organic semiconductors; area coverage; electrical performance; electronic paper; high resolution rubber stamping; microcontact printing; microencapsulated electrophoretic inks; organic semiconductors; pattern resolution; patterning; plastic active matrix drive circuitry; plastic electronics; printed element resolution; processing sequences; rubber stamped plastic circuits; Active matrix technology; Backplanes; Circuits; Displays; Electrodes; Ink; Plastics; Rubber; Switches; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916556

Filename

916556