Title :
High precision solder droplet printing technology: principle and applications
Author :
Liu, Qingbin ; Leu, Ming C. ; Orme, Melissa
Author_Institution :
Dept. of Mech. & Aerosp. Eng. & Eng. Mech., Missouri Univ., Rolla, MO, USA
Abstract :
Solder droplet printing technology, which is low-cost, noncontact, flexible, data-driven, and environmentally friendly, has emerged as an enabling technology for precisely placing fine solder deposits on a variety of small substrates. It is suitable for a variety of applications including direct chip attach site preparation, 3D substrates, fine line interconnect, substrate via fill, optoelectronics and many others. It enables manufacturing techniques that are impossible or unfeasible with current technology, such as localized replacement of solder on board, depositing solder in different thicknesses on the same board, or using more than one type of solder on the same board. This makes the evaluation of solder droplet printing technology essential for the microelectronics industry. In this paper, the principle of the solder droplet printing technology is described, recent experimental results are included, and potential applications of the technology in the microelectronics industry are evaluated
Keywords :
drops; fine-pitch technology; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; microassembling; soldering; 3D substrates; data-driven process; direct chip attach site preparation; environmentally friendly process; fine line interconnects; fine solder deposit placement; flexible process; localized solder replacement; manufacturing techniques; microelectronics industry; multi-type solder printing; noncontact process; optoelectronics; solder deposition thicknesses; solder droplet printing technology; substrate via fill; Aerospace engineering; Costs; Electronics packaging; Integrated circuit packaging; Integrated circuit technology; Lithography; Manufacturing; Microelectronics; Packaging machines; Printing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916557
