Author_Institution :
Tessera Inc, San Jose, CA, USA
Abstract :
Chip-scale or chip-size array packaging is currently in wide use throughout the industry, providing the solutions for applications that enable a reduced product size-to-function ratio. Portable or hand-held electronics is a natural target. Digital cameras and camcorders, for example, must consider ease of use, lighter weight and performance. Telephones, pagers, personal communicators, palm top computers, industrial and automotive electronics, personal GPS, medical and diagnostic products, are all viable candidates for more efficient device miniaturization. Memory devices are the first commodity type products in the market to adapt CSP in high volume; however, DSP, controllers, CPUs and any number of application specific IC devices are also prime candidates for chip-scale packaging
Keywords :
DRAM chips; SRAM chips; ball grid arrays; chip scale packaging; consumer electronics; integrated circuit interconnections; CPUs; CSP; DSP; RDRAM; application specific IC devices; automotive electronics; camcorders; chip size BGA packaging; chip-scale array packaging; chip-scale packaging; chip-size array packaging; commodity type products; controllers; device miniaturization; diagnostic products; digital cameras; double data rate SDRAM; hand-held electronics; industrial electronics; medical products; memory circuits; memory devices; pagers; palm top computers; personal GPS; personal communicators; portable electronics; product size-to-function ratio; telephones; Application software; Chip scale packaging; Communication industry; Computer industry; Consumer electronics; Digital cameras; Electronics industry; Electronics packaging; Telephony; Video equipment;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
