Title :
The design and properties of new, Pb-free solder alloys
Author :
McCormick, Matt ; Jin, S.
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
Environmental and health concerns about the toxicity of Pb in solders have prompted a great deal of research to find suitable Pb-free replacement alloys. The goal of the research presented in this paper is to identify Pb-free alloys as close in melting temperature to the near-eutectic 40 Pb-60 Sn solder (melting point of 183°C) that possess the best combination of mechanical properties. Enhanced mechanical properties are achieved through metallurgical manipulation of alloy microstructures. Three alloys are presented with superior mechanical properties: i) Sn-3.5 Ag-1 Zn with a melting point of ~217°C, ii) Sn-3.5Ag-1 Zn-0.5 Cu with a melting point of ~226°C, and iii) Sn-8Zn-5In-(O.1-0.5)Ag with a melting point of ~187°C
Keywords :
copper alloys; indium alloys; mechanical properties; melting point; silver alloys; soldering; tin alloys; zinc alloys; 187 to 217 C; Pb-free solder alloys; SnAgZn; SnZnAgCu; SnZnInAg; mechanical properties; melting point; Costs; Electronics packaging; Lead; Manufacturing; Material properties; Mechanical factors; Microstructure; Soldering; Temperature dependence; Water pollution;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404698