Title :
Schottky source/drain Al2O3/InAlN/GaN MIS-HEMT with steep sub-threshold swing and high ON/OFF current ratio
Author :
Qi Zhou ; Huang, Sen ; Hongwei Chen ; Zhou, Chunhua ; Feng, Zhihong ; Cai, Shujun ; Chen, Kevin J.
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
Abstract :
Al2O3/InAlN/GaN MISHEMTs with Schottky source and drain were experimentally demonstrated with steep subthreshold swing (SS) at room temperature as well as high temperature up to 150 °C. The mechanism for the steep SS was proposed to be based on the dynamic discharging process of the interface states at the Al2O3/InAlN interface and the resultant positive feedback in the turn-on of the drain current. The model was validated by temperature-dependent characterization. The use of the Schottky source/drain contacts can effectively prevent the off-state leakage current, leading to high ON/OFF current ratio of ~1010 in the proposed devices. At room temperature, SS as low as 6.6 mV/dec was observed and SS lower than 60 mV/dec was obtained over a wide drain bias range of 3~10 V during the forward sweep of VGS. The proposed device delivers a maximum drain current density of 416 mA/mm and peak extrinsic transconductance of 113 mS/mm.
Keywords :
III-V semiconductors; MIS devices; Schottky barriers; alumina; current density; gallium compounds; high electron mobility transistors; indium compounds; interface states; leakage currents; wide band gap semiconductors; Al2O3-InAlN-GaN; MISHEMT; ON/OFF current ratio; Schottky source/drain MIS-HEMT; Schottky source/drain contacts; VGS; drain current density; dynamic discharging process; interface states; off-state leakage current; peak extrinsic transconductance; resultant positive feedback; steep SS; steep subthreshold swing; temperature-dependent characterization; wide drain bias range; Gallium nitride; Gold; HEMTs; Logic gates; MODFETs; Ohmic contacts; Temperature measurement;
Conference_Titel :
Electron Devices Meeting (IEDM), 2011 IEEE International
Conference_Location :
Washington, DC
Print_ISBN :
978-1-4577-0506-9
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2011.6131664