DocumentCode :
3040173
Title :
Let´s revise the ASTM method F.459 for wirebonding process control
Author :
Van Pham, Cuong ; Huth, Ken
fYear :
2001
fDate :
2001
Firstpage :
186
Lastpage :
194
Abstract :
Wire pull testing cannot be used to monitor wirebonding process control as the X-bar and R charts of row pull strength data routinely demonstrate wide variations. The bonding process appears to be out-of-control; indeed, the testing methodology and data collection itself are inaccurate in representing the process. Many factors, which are difficult to control in production, can subtly affect the raw SPC data. This paper reviews the pull test method used to identify the potential variation(s) that causes the errors and are misleading in the process control. The paper also includes the efforts to revise the ASTM´s method F.459 for its pull test in making the data collected using this method applicable in the statistic process control (SPC) chart
Keywords :
adhesion; error analysis; integrated circuit interconnections; integrated circuit packaging; lead bonding; mechanical testing; standards; statistical process control; ASTM method F.459; SPC chart; bonding process; data collection; process representation; process variation; production control; pull test method; raw SPC data; row pull strength data charts; statistic process control chart; testing methodology; wire pull testing; wirebonding process control; wirebonding process monitoring; Bonding forces; Bonding processes; Differential equations; Hydrogen; Monitoring; Process control; Production; Scanning probe microscopy; Testing; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
Type :
conf
DOI :
10.1109/ISAOM.2001.916573
Filename :
916573
Link To Document :
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