DocumentCode :
3040288
Title :
Highly compact and efficient JTRS radios using superconductor microelectronics - a quantum leap in performance: the cryopackage
Author :
Track, Elie K. ; Hitt, Richard E., Jr. ; Gupta, Deep
Author_Institution :
HYPRES Inc, New York, NY, USA
fYear :
2004
fDate :
26-27 Apr 2004
Firstpage :
87
Lastpage :
90
Abstract :
Superconductor microelectronics (SME) are rapidly redefining the state-of-the-art in wireless RF performance. SME-based digital RF subsystems, enabled by compact cryocoolers, have the potential to achieve all JTRS objective requirements (not just the thresholds) for performance, SWaP, and Cost as an Independent Variable (CAIV) targets for clusters 1, 3 and 4. Compact cryo-packaging is the key to deploying SME-based digital RF subsystems in JTRS and other wireless radio systems. A compact cryocooler provides the cryogenic environment for the superconductor multi-chip modules (MCM). The cryo-package (comprising the MCM and compact cryocooler) includes the mechanical and electrical interfaces to the JTRS radio. For example, a single SME-based digital RF subsystem provides a 10-channel full-duplex transceiver in less than 500 in3, 30 lbs, and 150 watts; and an availability (up time) on the order of 99.998%. This paper discusses all aspects of cryopackaging, which include compact closed-cycle refrigerators or cryocoolers, methods of building and cooling superconductor multi-chip modules, managing thermal loads of input-output leads between warm ambient temperature electronics and cold superconductor electronics, and electromagnetic shielding.
Keywords :
cryogenics; electromagnetic shielding; military communication; multichip modules; refrigerators; superconducting integrated circuits; thermal management (packaging); transceivers; 10-channel full-duplex transceiver; CAIV; Cost as an Independent Variable; JTRS radios; MCM; SME; SWaP; closed-cycle refrigerators; compact cryocoolers; cryopackage; digital RF subsystems; electromagnetic shielding; input-output leads; military communication; performance; superconductor microelectronics; superconductor multi-chip modules; thermal management; Costs; Cryogenics; Electronics cooling; Microelectronics; Radio frequency; Refrigerators; Superconducting filaments and wires; Thermal management; Thermal management of electronics; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advances in Wired and Wireless Communication, 2004 IEEE/Sarnoff Symposium on
Print_ISBN :
0-7803-8219-6
Type :
conf
DOI :
10.1109/SARNOF.2004.1302847
Filename :
1302847
Link To Document :
بازگشت