High frequency measurement of isotropic conductive adhesives

Author

Zhang, Zhuqing ; Liong, Silvia ; Wong, C.P.

Author_Institution

Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

246

Lastpage

250

Abstract

Isotropic conductive adhesives (ICAs) have some distinct advantages over SnPb solders as interconnect materials. With the increasing frequencies applied in electronics, the electrical properties of ICAs at high frequency must be investigated. A flip-chip test vehicle is designed and manufactured. FR-4 board is used as the substrate and gold plate copper as the transmission line. SnPb solder paste and ICA are applied using stencil printing and assembled. A network analyzer is used to study the signal reflection and transmission of the test vehicles. Results show that there is no significant difference between ICA joints and SnPb joints in the frequency range from 45 MHz to 2 GHz. A high-frequency substrate is needed in order to investigate the characteristics of ICA and SnPb solder at a higher frequency range

Keywords

UHF integrated circuits; UHF measurement; adhesives; assembling; conducting polymers; flip-chip devices; integrated circuit reliability; integrated circuit testing; network analysers; 45 MHz to 2 GHz; Au-Cu; CA joints; FR-4 board substrate; HF electrical properties; ICAs; SnPb; SnPb joints; SnPb solder paste; SnPb solders; assembly; flip-chip test vehicle; frequency range; gold plate copper transmission line; high frequency measurement; high-frequency substrate; interconnect materials; isotropic conductive adhesives; network analyzer; signal reflection; signal transmission; stencil printing; test vehicles; Conducting materials; Conductive adhesives; Copper; Frequency measurement; Gold; Independent component analysis; Manufacturing; Testing; Transmission lines; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on

Conference_Location

Braselton, GA

Print_ISBN

0-930815-64-5

Type

conf

DOI

10.1109/ISAOM.2001.916583

Filename

916583