• DocumentCode
    3040487
  • Title

    Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application

  • Author

    Rao, Yang ; Yue, Jireh ; Wong, C.P.

  • Author_Institution
    Package Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    280
  • Lastpage
    285
  • Abstract
    Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer-ceramic composite with very high dielectric constant (εr~150, a new record for the highest reported εr value for a nano-composite) has been developed in previous work. RF application of embedded capacitors requires that the insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in-house developed novel high dielectric constant polymer-ceramic nano-composite. Results show that this material has a fairly high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. An 85/85 TH aging test has been performed and has shown that this novel high-k material has good reliability. An embedded capacitor prototype with capacitance density of 35 nF/cm has been manufactured using this nano-composite with spin coating technology. This novel nano-composite can be used for integral capacitors in RF applications
  • Keywords
    ageing; capacitance; capacitors; composite insulating materials; dielectric thin films; electron device testing; microwave devices; permittivity; reliability; spin coating; 85 C; RF application; RF applications; RF range; TH aging test; assembly cost; breakdown voltage; capacitance density; ceramic electrical properties; dielectric constant; discrete capacitor technology; electrical leakage; electrical performance; electrical tests; embedded capacitor; embedded capacitor material; embedded capacitor prototype; embedded capacitor technology; embedded capacitors; high dielectric constant polymer-ceramic composite; high-k material; insulating material; integral capacitors; leakage current; material characterization; nano-structure polymer-ceramic composite; polymer processability; polymer-ceramic composites; reliability; spin coating technology; Assembly; Capacitors; Conducting materials; Costs; Dielectric materials; High K dielectric materials; High-K gate dielectrics; Materials reliability; Polymers; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
  • Conference_Location
    Braselton, GA
  • Print_ISBN
    0-930815-64-5
  • Type

    conf

  • DOI
    10.1109/ISAOM.2001.916589
  • Filename
    916589