DocumentCode :
3040524
Title :
Fundamental study on moisture absorption in epoxy for electronic application
Author :
Luo, Shijian ; Wong, C.P. ; Leisen, Johannes
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2001
fDate :
2001
Firstpage :
293
Lastpage :
298
Abstract :
This paper presents a fundamental study of moisture absorption in epoxy materials. Solid state nuclear magnetic resonance (NMR) techniques (both 1H NMR and 2H NMR) were used to study the binding states of water within two epoxy formulations along with the possible plasticizing effects of moisture affecting the mobility of polymer chains. Absorbed water reduces the glass transition temperature. However, the presence of moisture has no significant effect on the polymer chain mobility at temperatures below the reduced glass transition temperature. Water in an epoxy in its rubbery state above the glass transition has a much higher mobility than in a polymer in its glassy state. The mobility of water absorbed by a polymer in its rubbery state is similar to that of pure water
Keywords :
adsorption; glass transition; moisture; nuclear magnetic resonance; packaging; plasticity; polymers; H2O; absorbed water; electronic application; epoxy; epoxy formulations; epoxy materials; glass transition temperature; glassy state; moisture; moisture absorption; plasticizing effects; polymer chain mobility; rubbery state; solid state NMR techniques; solid state nuclear magnetic resonance techniques; water binding states; water mobility; Absorption; Electronics packaging; Glass; Hybrid integrated circuits; Materials science and technology; Mechanical factors; Moisture; Nuclear magnetic resonance; Polymers; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
Type :
conf
DOI :
10.1109/ISAOM.2001.916591
Filename :
916591
Link To Document :
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