• DocumentCode
    3040634
  • Title

    Resistance of conductive adhesive joints on non-noble surface finishes

  • Author

    Ivanov, Vitalii ; Boehme, Bjoern ; Wolter, Klaus Juergen

  • Author_Institution
    Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany
  • fYear
    2012
  • fDate
    9-13 May 2012
  • Firstpage
    254
  • Lastpage
    259
  • Abstract
    Electrically conductive adhesives (ECAs) have number of advantages comparing to solder joints. They are environmentally friendly and have lower processing temperature that makes them suitable for manufacturing of LCD´s or connecting flexible solar cell arrays in modules. However, in flexible solar cells the metal contact is usually made of non-noble metal, and this joint can suffer from decrease of conductivity at the operation environment. In this work the joint behavior between different metal surfaces (Au, Sn, Mo) and ECAs during different ageing conditions is investigated. The aim of the work is to investigate the degradation of non-noble metal-ECA joints in order to predict the reliability of such an electrical contact. The results of the literature review and ageing experiments are presented. The ageing conditions were 120 °C thermal ageing and damp heat test (85 °C/85RH). The test samples were manufactured on FR-4-boards with metal stripes and applied ECAs between them. The experiments are focused on the electrical conductivity. The experiments have shown significant increase in joint resistance after 85 °C/85RH, while under 120 °C ageing a slight decrease was observed.
  • Keywords
    ageing; conductive adhesives; electrical conductivity; electrical contacts; gold alloys; molybdenum alloys; reliability; surface finishing; tin alloys; Au; FR-4-boards; LCD; Mo; Sn; ageing conditions; conductive adhesive joint resistance; damp heat test; electrical conductivity; electrical contact; electrically conductive adhesives; flexible solar cell arrays; metal contact; metal stripes; metal surfaces; nonnoble metal; nonnoble metal-ECA joints; nonnoble surface finishes; reliability; solder joints; temperature 120 degC; temperature 85 degC; thermal ageing; Aging; Contact resistance; Joints; Nickel; Resistance; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2012 35th International Spring Seminar on
  • Conference_Location
    Bad Aussee
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4673-2241-6
  • Electronic_ISBN
    2161-2528
  • Type

    conf

  • DOI
    10.1109/ISSE.2012.6273082
  • Filename
    6273082