Title :
Application of flow microcalorimetry to develop underfill resins
Author :
Pearson, Raymond A. ; Welsh, Dave J. ; Oldak, Robert O. ; McAdams, Brian J.
Author_Institution :
Microelectron. Packaging Mater. Lab., Lehigh Univ., Bethlehem, PA, USA
Abstract :
A series of model underfill resins with different chemical structures have been characterized using flow microcalorimetry (FMC). FMC allows the direct observation of the strength of adsorption of molecules on to a surface. In this case, epoxy monomers, curing agents, and adhesion promoters, were adsorbed on to a borosilicate glass powder in an effort to predict adhesive strength. Adhesive strengths were measured mechanically using an asymmetric double cantilever beam test. Adhesive strengths of filled and unfilled epoxy resins were measured and often correlated to FMC results. Scanning electron and optical microscopy were used to identify mechanisms of plasticity/damage at interfacial crack tips. Greater adhesion strength can be attributed to increased damage near the crack tips. Such damage is enabled by strong molecular interactions at the interface
Keywords :
adhesion; adsorption; calorimetry; encapsulation; filled polymers; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; interface structure; plasticity; polymer films; scanning electron microscopy; FMC; adhesion promoters; adhesion strength; adhesive strength; adsorption strength; asymmetric double cantilever beam; asymmetric double cantilever beam test; borosilicate glass powder; chemical structures; crack tip damage; curing agents; damage mechanisms; epoxy monomers; filled epoxy resins; flow microcalorimetry; interfacial crack tips; mechanical measurement; model underfill resins; optical microscopy; plasticity; scanning electron microscopy; strong molecular interactions; underfill resins; unfilled epoxy resins; Adhesive strength; Chemicals; Curing; Glass; Mechanical variables measurement; Optical microscopy; Powders; Resins; Structural beams; Testing;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2001. Proceedings. International Symposium on
Conference_Location :
Braselton, GA
Print_ISBN :
0-930815-64-5
DOI :
10.1109/ISAOM.2001.916606