• DocumentCode
    3040923
  • Title

    Influence of curing technologies on the application quality of PTF-conductive pastes

  • Author

    Schulze, J. ; Bauer, R.

  • Author_Institution
    Hochschule fur Tech. und Wirtschaft (HTW), Univ. of Appl. Sci. Dresden, Dresden, Germany
  • fYear
    2012
  • fDate
    9-13 May 2012
  • Firstpage
    15
  • Lastpage
    18
  • Abstract
    The Polymer Thick Film Technology permits a cost efficient production of electronic circuits. The technology permits through a screen printing process the application of different polymer pastes of flexible and rigid substrate. This allows the production of electronic circuits in a short time. After that are develop the functional characteristics of the polymer pastes through a temperature process. Like any technology have this some disadvantages such as low electrical conductivity and limited assembly capability.
  • Keywords
    curing; polymer films; thick films; PTF-conductive pastes; application quality; cost efficient production; curing technologies; electrical conductivity; electronic circuits; functional characteristics; polymer pastes; polymer thick film technology; screen printing process; temperature process; Conductivity; Curing; Electron beams; Polymers; Soldering; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2012 35th International Spring Seminar on
  • Conference_Location
    Bad Aussee
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4673-2241-6
  • Electronic_ISBN
    2161-2528
  • Type

    conf

  • DOI
    10.1109/ISSE.2012.6273100
  • Filename
    6273100