• DocumentCode
    3040999
  • Title

    Ohmic loss reduction and gain enhancement of microstrip antennas using laminated conductors

  • Author

    Latif, Saeed I. ; Shafai, Lotfollah ; Shafai, Cyrus

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Manitoba, Winnipeg, MB
  • fYear
    2009
  • fDate
    15-18 Feb. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In order to enhance the gain of miniaturized microstrip antennas, a novel technique is developed where the conductor of miniaturized ring antennas is formed by depositing multiple conductor layers separated by dielectric lamination. The laminating dielectric thickness is smaller or of the order of the skin depth of the conductor. First, it is shown analytically that when multiple laminated conducting material layers are used for a planar material, the power lost in the material is less compared to the case with a single solid layer. The concept is then used in microstrip ring antennas for enhancing their gain. The use of multiple laminated conductors essentially reduces the ohmic loss of these antennas. Experimental results are discussed to validate the concept.
  • Keywords
    conducting bodies; laminations; microstrip antennas; planar antennas; dielectric lamination; gain enhancement; laminated conductors; microstrip antenna; multiple conductor layers; ohmic loss reduction; planar material; ring antennas; single solid layer; Conducting materials; Conductors; Dielectric losses; Dielectric materials; Electromagnetics; Magnetic fields; Microstrip antennas; Permeability; Permittivity; Skin; gain enhancement; microstrip antenna; miniaturized antenna; ohmic loss reduction; ring antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antenna Technology and Applied Electromagnetics and the Canadian Radio Science Meeting, 2009. ANTEM/URSI 2009. 13th International Symposium on
  • Conference_Location
    Toronto, ON
  • Print_ISBN
    978-1-4244-2979-0
  • Electronic_ISBN
    978-1-4244-2980-6
  • Type

    conf

  • DOI
    10.1109/ANTEMURSI.2009.4805085
  • Filename
    4805085