Title :
Possibilities of making 3D resistors in LTCC technology
Author :
Klíma, Martin ; Szendiuch, Ivan
Author_Institution :
Dept. of Microelectron., Brno Univ. of Technol., Brno, Czech Republic
Abstract :
The Article deals with three-dimensional (3D) resistors making in Low Temperature Co-fired Ceramic (LTCC) substrates. It is especially focused on a manner of fabrication and design for reliability and reproducibility. 3D resistors are created of vias filled with a resistive paste. To fill the vias, stencil-printing is used. There are two ways of their arrangement through more layers - directly in line or zigzag. The research targets on finding the optimal count of connected layers, structure of resistive paste after firing, scattering of values of resistivity.
Keywords :
reliability; resistors; 3D resistor fabrication; LTCC technology; low temperature cofired ceramic substrates; reliability; resistive paste structure; stencil-printing; three-dimensional resistors; Conductivity; Joining processes; Lamination; Printing; Resistors; Springs; Substrates;
Conference_Titel :
Electronics Technology (ISSE), 2012 35th International Spring Seminar on
Conference_Location :
Bad Aussee
Print_ISBN :
978-1-4673-2241-6
Electronic_ISBN :
2161-2528
DOI :
10.1109/ISSE.2012.6273107
