Title :
Thermoelectric figure of merit of silicide two-dimensional quantum wells
Author :
Yamamoto, A. ; Ohta, T.
Author_Institution :
Electrotech. Lab., Ibaraki, Japan
Abstract :
The calculation was made to estimate thermoelectric figure of merit ZT of quantum well structured films made of transition metal (TM) silicide, alloys of silicon and germanium, etc. All materials listed (Si 70Ge30, MnSi2.7, Ru2Si3 , FeSi2, CrSi2) are investigated as good thermoelectric materials and furthermore have possibilities of epitaxial growth on silicon. 1-dimensional quantum confinement of charge carrier with quantum well structure were assumed in the calculation model. Transport properties parallel to the layer was estimated as a function of well width. Full account was made of Fermi statistics, and thermal conduction in the barrier layer was taken into account. Results of the calculation indicate that moderate increase in ZT is possible in modulated doping superlattice structure of TM silicides. But ZT decreases with decreasing well width in combinations of silicon and TM silicides. This is due to the large thermal conductivity of silicon used as a barrier material
Keywords :
Ge-Si alloys; chromium alloys; heat conduction; iron alloys; manganese alloys; minority carriers; ruthenium; semiconductor quantum wells; silicon alloys; thermal conductivity; thermoelectric conversion; 1-dimensional quantum confinement; CrSi2; FeSi2; Fermi statistics; MnSi2.7; Ru2Si3; Si70Ge30; barrier layer; charge carrier; epitaxial growth; modulated doping superlattice structure; silicide two-dimensional quantum wells; thermal conduction; thermal conductivity; thermoelectric energy conversion; thermoelectric figure of merit; transition metal silicides; transport properties; Conducting materials; Epitaxial growth; Germanium alloys; Germanium silicon alloys; Semiconductor films; Silicides; Silicon alloys; Silicon germanium; Thermal conductivity; Thermoelectricity;
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-3547-3
DOI :
10.1109/IECEC.1996.553819