Title :
Glass Microprobe with Embedded Silicon Vias for 3D Integration
Author :
Lin, Chiung-Wen ; Chang, Chih-Wei ; Lee, Yu-Tao ; Chen, Rongshun ; Chang, Yen-Chung ; Fang, Weileun
Author_Institution :
Inst. of NanoEng. & Microsyst., Nat. Tsing Hua Univ., Hsinchu
Abstract :
This study presents a novel process to realize glass 2D-microprobe array. The through silicon vias (TSVs) can also be integrated with the glass 2D-microprobe using the micromachining process. The vertical integration of chips containing glass 2D-microprobe array is realized using these silicon TSVs. The 3D-microprobe array and the signal processing IC can be easily implemented after vertical assembly of 2D-microprobe chips using bonding. In application, the 2D glass microprobe is fabricated with a low impedance of 439 kOmega at 1 kHz; and the neural recording experiment has also been successfully performed on a rat.
Keywords :
bioMEMS; bioelectric phenomena; biomedical electrodes; biomedical electronics; biomedical measurement; glass; integrated circuit design; microelectrodes; micromachining; neurophysiology; 2D glass microprobe array; 2D microprobe chips; 3D integration; Si; bonding; embedded silicon via; frequency 1 kHz; micromachining process; neural recording experiment; resistance 439 kohm; signal processing integrated circuit; through silicon vias; vertical chip integration; Array signal processing; Assembly; Biomedical signal processing; Electrodes; Glass; Micromachining; Probes; Shape control; Silicon; Stacking;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805353
