Title :
Ultra-Compact Integration for Fully-Implantable Neural Microsystems
Author :
Perlin, G.E. ; Wise, K.D.
Author_Institution :
Center for Wireless Integrated Microsyst., Univ. of Michigan, Ann Arbor, MI
Abstract :
A new approach to microsystem integration to replace conventional area-consuming platform architectures with an overlay integration cable is presented. A parylene cable carrying interconnect lines is used to integrate a 3-D array of silicon microelectrodes with a custom-designed signal conditioning chip to realize a neural recording microsystem in its most compact form. This low-profile integrated front-end was implanted in a guinea pig and used to obtain discriminable neural activity.
Keywords :
biomedical electrodes; elemental semiconductors; neurophysiology; prosthetics; silicon; Si; area-consuming platform architectures; custom-designed signal conditioning chip; fully implantable neural microsystems; guinea pig; neural recording microsystem; parylene cable carrying interconnect lines; silicon microelectrodes; ultracompact integration; Neural microtechnology;
Conference_Titel :
Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
Conference_Location :
Sorrento
Print_ISBN :
978-1-4244-2977-6
Electronic_ISBN :
1084-6999
DOI :
10.1109/MEMSYS.2009.4805360
