• DocumentCode
    3043269
  • Title

    CMOS-Based High-Density Silicon Microprobe Array for Electronic Depth Control in Neural Recording

  • Author

    Seidl, K. ; Herwik, S. ; Nurcahyo, Y. ; Torfs, T. ; Keller, M. ; Schuttler, M. ; Neves ; Stieglitz, T. ; Paul, O. ; Ruther, P.

  • Author_Institution
    Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg
  • fYear
    2009
  • fDate
    25-29 Jan. 2009
  • Firstpage
    232
  • Lastpage
    235
  • Abstract
    This paper reports on a novel CMOS-based high-density silicon microprobe array for intracortical recording applications. In contrast to existing systems, CMOS multiplexing units are integrated on the slender, needle-like probe shaft 160 mum in width. In the present implementation an unequaled number of 188 electrodes (diameter 20 mum, pitch 40 mum) are arranged in two columns along the 4-mm-long probe shaft. The on-shaft integration of electronics is motivated by the requirement to discriminate single action potentials in extracellular recordings necessitating a close proximity between the neuron of interest and the recording electrode. Instead of a mechanical movement of the probe shaft carrying the electrode, the position adjustment during long-term recordings is performed by switching between different electrodes arranged in a dense array. The paper presents the probe concept, the post-CMOS fabrication process and initial measurements evaluating electrode impedance and probe performance during measurements in saline solution.
  • Keywords
    CMOS integrated circuits; bioMEMS; biomedical electrodes; biosensors; neurophysiology; silicon; CMOS; Si; electrode impedance; electrodes; electronic depth control; high density silicon microprobe array; neural recording; position adjustment; probe performance; probe shaft; saline solution; Circuits; Disk recording; Electrodes; Impedance measurement; Joining processes; Microelectronics; Neurons; Probes; Shafts; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on
  • Conference_Location
    Sorrento
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-2977-6
  • Electronic_ISBN
    1084-6999
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2009.4805361
  • Filename
    4805361