Integrated Wireless Neurostimulator

Author

Li, W. ; Rodger, D.C. ; Tai, Y.C.

Author_Institution

California Inst. of Technol., Pasadena, CA

fYear

2009

fDate

25-29 Jan. 2009

Firstpage

248

Lastpage

251

Abstract

This paper presents the design, fabrication and functional testing of a fully implantable, flexible, Parylene-enabled neurostimulator that features single channel wireless stimulation capability. The system comprises a CMOS stimulator chip, a fold-and-bond RF coil, two platinum electrodes, and discrete capacitors. The MEMS components are fabricated with a Parylene-metal skin technology, and the system assembly is achieved by interconnecting individual components together on a Parylene substrate with silver epoxy. The functionality of the integrated system is verified using a telemetry link setup, and single-phase pulses with amplitudes ranging from 7 to 8.5 V are detected.

Keywords

CMOS integrated circuits; bioMEMS; bioelectric phenomena; biomedical electrodes; neurophysiology; platinum; polymers; prosthetics; silver; wireless sensor networks; Ag; CMOS stimulator chip; Parylene substrate; Parylene-metal skin technology; Pt; bioMEMS; discrete capacitors; fold and bond RF coil; integrated wireless neurostimulator; platinum electrodes; silver epoxy; single channel wireless stimulation; CMOS technology; Capacitors; Coils; Electrodes; Fabrication; Micromechanical devices; Platinum; Radio frequency; Skin; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2009. MEMS 2009. IEEE 22nd International Conference on

Conference_Location

Sorrento

ISSN

1084-6999

Print_ISBN

978-1-4244-2977-6

Electronic_ISBN

1084-6999

Type

conf

DOI

10.1109/MEMSYS.2009.4805365

Filename

4805365