• DocumentCode
    3043373
  • Title

    Exploiting loop-level parallelism on multi-core architectures for the wimax physical layer

  • Author

    Yi, Ying ; Han, Wei ; Major, Adam ; Erdogan, Ahmet T. ; Arslan, Tughrul

  • Author_Institution
    Univ. of Edinburgh, Edinburgh
  • fYear
    2008
  • fDate
    17-20 Sept. 2008
  • Firstpage
    31
  • Lastpage
    34
  • Abstract
    Multiprocessor system-on-chip (MPSoC) architectures are increasingly being adopted in the design of emerging complex embedded systems. This paper introduces a new application mapping technique for MPSoC architectures using a case study. The technique incorporates profiling-driven task partitioning, task transformations, loop level partitioning and memory architecture aware data mapping to reduce system execution time. Experiments are conducted to evaluate the technique by implementing the WiMAX physical layer on several multi-core architectures based on newly emerging dynamically reconfigurable processor cores. The results demonstrate that the proposed technique is able to generate high-quality mappings of realistic applications on the target architecture, achieving up to 4.92x speedup by employing only five dynamically reconfigurable processor cores.
  • Keywords
    memory architecture; multiprocessing systems; reconfigurable architectures; system-on-chip; wireless LAN; MPSoC architectures; WiMAX physical layer; complex embedded systems; data mapping; loop level partitioning; loop-level parallelism; memory architecture; multicore architectures; multiprocessor system-on-chip; profiling-driven task partitioning; reconfigurable processor cores; task transformations; Buildings; Energy consumption; Libraries; Memory architecture; Merging; Multiprocessing systems; Physical layer; Processor scheduling; Registers; WiMAX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOC Conference, 2008 IEEE International
  • Conference_Location
    Newport Beach, CA
  • Print_ISBN
    978-1-4244-2596-9
  • Electronic_ISBN
    978-1-4244-2597-6
  • Type

    conf

  • DOI
    10.1109/SOCC.2008.4641474
  • Filename
    4641474