DocumentCode :
304343
Title :
Experiments and analyses of flat miniature heat pipes
Author :
Cao, Y. ; Gao, M. ; Beam, J.E. ; Donovan, B.
Author_Institution :
Dept. of Mech. Eng., Florida Int. Univ., Miami, FL, USA
Volume :
2
fYear :
1996
fDate :
11-16 Aug 1996
Firstpage :
1402
Abstract :
Two flat copper-water axially-grooved miniature heat pipes are fabricated employing the electric-discharge-machining (EDM) wire-cutting method. Due to the advantage of the EDM method, axial grooves are provided around the entire interior perimeters of the miniature heat pipes. The two miniature heat pipes are tested under different heat inputs, cooling temperatures, and orientations. The maximum heat transfer rate for the heat pipes tested is about 40 W, and the maximum heat flux achieved is about 20 W/cm2 The effective thermal conductance of the heat pipe is on the order of 40 times that of copper based on the external cross-sectional area of the miniature heat pipe. If the effective thermal conductance is evaluated based on the interior cross-sectional area of the heat pipe, it can be 100 times higher than the thermal conductivity of copper. Analyses for heat pipe limitations are also performed based on some analytical relations. It is found that the capillary limit is the dominant heat transfer limitation for the miniature heat pipes tested in this paper. To improve the accuracy of the analytical model, the hydraulic radius in the capillary limit is corrected using the exact two-dimensional solutions found in the literature, and the expression for the friction factor that takes into account the shear stress at the liquid/vapor interface is adopted. The analytical results based on these modifications are compared with corresponding experimental results with good agreement
Keywords :
heat pipes; heat transfer; spark machining; thermal analysis; thermal conductivity; 40 W; EDM fabrication; capillary limit; cooling temperature; effective thermal conductance; flat miniature heat pipes; friction factor; heat input; heat transfer limitation; liquid/vapor interface; maximum heat flux; maximum heat transfer rate; model accuracy; orientation; shear stress; thermal conductivity; wire-cutting method; Analytical models; Cooling; Copper; Friction; Heat transfer; Performance analysis; Resistance heating; Temperature; Testing; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Energy Conversion Engineering Conference, 1996. IECEC 96., Proceedings of the 31st Intersociety
Conference_Location :
Washington, DC
ISSN :
1089-3547
Print_ISBN :
0-7803-3547-3
Type :
conf
DOI :
10.1109/IECEC.1996.553927
Filename :
553927
Link To Document :
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