Title :
Characterization of Au-bumped eight inch wafers for TAB assembly
Author :
Chen, Wayne ; Kraft, Dina ; Manitt, Jim ; Higgins, Leo
Author_Institution :
MMTG Adv. Packaging & Assembly Manuf., Motorola Inc., Austin, TX, USA
Abstract :
TAB packaging of Fast Static RAM (FSRAM) devices is expanding rapidly. The FSRAMs are moving to manufacture on 8" wafers, so Motorola has been contemplating the expansion of the existing 6" wafer bumping fab in Chandler to create an 8" wafer bumping fab for TAB assembly for the past two years. Establishment of the 8" capability would require the investment of a very significant amount of capital. This paper addresses the use of subcontract 8" wafer bumping, services of Vendor A and Vendor B, as the strategic alternatives. This study establishes a database for the evaluation of 8" wafer bumping capability. Parallel efforts in the development of alternative inner lead bond technology has also allowed the development of a yardstick for measuring the reliability performance of the alternative TAB processes, such as bumpless, ball bumping as well as transfer bump technologies
Keywords :
SRAM chips; gold; integrated circuit manufacture; integrated circuit packaging; integrated circuit reliability; lead bonding; tape automated bonding; 6 in; 8 in; Au; Au-bumped eight inch wafers; Motorola; SRAM assembly; TAB assembly; TAB packaging; fast static RAM devices; inner lead bond technology; reliability performance; wafer bumping fab; Assembly; Design optimization; Gold; Investments; Manufacturing; Packaging; Sampling methods; Testing; Vehicles; Wafer bonding;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1994. Low-Cost Manufacturing Technologies for Tomorrow's Global Economy. Proceedings 1994 IEMT Symposium., Sixteenth IEEE/CPMT International
Conference_Location :
La Jolla, CA
Print_ISBN :
0-7803-2037-9
DOI :
10.1109/IEMT.1994.404716
