Residual gas analysis as a failure analysis tool for microelectronic devices

Author

Kumar, Arun ; Carreon, Mark

Author_Institution

SEAL Lab., El Segundo, CA, USA

fYear

1996

fDate

22-24 Oct 1996

Firstpage

114

Lastpage

115

Abstract

Moisture measurement is the most important information obtained during the residual gas analysis (RGA) of microelectronic packages containing cavities. The MIL-STD-883, Method 1018.2 specification has a moisture requirement of 5000 ppmv maximum. In addition to moisture analysis during RGA, several other gases are also analyzed; most common gaseous species analyzed are nitrogen oxygen, carbon dioxide, hydrogen, argon, helium, fluorocarbons, methane, and ammonia. Based on this, conclusions can be made regarding the internal atmosphere, sources of moisture, hermeticity of the package, outgassing from the die attach epoxy material or other organic materials, etc., during failure analysis of devices that fail to meet the moisture requirements or do not reflect the anticipated gas composition

Keywords

chemical analysis; failure analysis; integrated circuit packaging; moisture measurement; MIL-STD-883 Method 1018.2; cavity; die attach epoxy material; failure analysis; hermeticity; microelectronic package; moisture measurement; organic material; outgassing; residual gas analysis; Carbon dioxide; Failure analysis; Gases; Hydrogen; Information analysis; Microelectronics; Moisture measurement; Nitrogen; Organic materials; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

WESCON/96

Conference_Location

Anaheim, CA

ISSN

1095-791X

Print_ISBN

0-7803-3274-1

Type

conf

DOI

10.1109/WESCON.1996.553974

Filename

553974