VCSEL/CMOS smart pixel arrays for free-space optical interconnects

Author

Neff, John A. ; Chen, Christine ; McLaren, Tim ; Mao, Chong-Chang ; Fedor, Adam ; Berseth, Wes ; Lee, Y.C. ; Morozov, Valentin

Author_Institution

Optoelectron. Comput. Syst. Center, Colorado Univ., Boulder, CO, USA

fYear

1996

fDate

27-29 Oct 1996

Firstpage

282

Lastpage

289

Abstract

This paper describes a VCSEL-Si smart pixel array technology, developed at the University of Colorado, and reports on an optoelectronic processor that is based on these hybrid SPAs. This effort is unique in the processing complexity of the pixels, in the bidirectionary of the optical interconnects, and in the thermosonic bonding of the VCSEL and silicon chips

Keywords

CMOS integrated circuits; integrated optoelectronics; laser cavity resonators; lead bonding; optical computing; optical interconnections; semiconductor laser arrays; silicon; smart pixels; surface emitting lasers; Si; University of Colorado; VCSEL-Si smart pixel array technology; VCSEL/CMOS smart pixel arrays; bidirectionary; free-space optical interconnects; hybrid SPAs; optoelectronic processor; processing complexity; silicon chips; thermosonic bonding; Bonding; High speed optical techniques; Holographic optical components; Holography; Optical arrays; Optical interconnections; Optical receivers; Optical signal processing; Smart pixels; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Massively Parallel Processing Using Optical Interconnections, 1996., Proceedings of the Third International Conference on

Conference_Location

Maui, HI

Print_ISBN

0-8186-7591-8

Type

conf

DOI

10.1109/MPPOI.1996.559111

Filename

559111