DocumentCode :
3043778
Title :
A wavelet method based on goodness of fit test for roughness of micro-EDM
Author :
Chen, Zhijie ; Shen, Jihong ; Guo, Libin
Author_Institution :
Coll. of Sci., Harbin Eng. Univ., Harbin, China
fYear :
2010
fDate :
20-23 June 2010
Firstpage :
2026
Lastpage :
2030
Abstract :
The surface topography errors of micro electrical discharge machining (Micro-EDM) are mainly composed of surface roughness, surface waveness and profile error, which have influence on the workpiece´s functions and performances in various degrees. Thus, how to pick up these errors without distortion is quite important for evaluating the surface topography. Further research shows that the frequency of surface roughness, surface waveness and profile error are different. Surface roughness belongs to high frequency, comparatively, surface waveness and profile error belong to low frequency. It is well known that Wavelet Transform has good time-frequency localization properties, which is especially suitable for signals De-noising. Therefore, in this paper, a wavelet method for roughness of Micro-EDM´s surface contour lines is presented, in which, it is demonstrated that multiresolution analysis is feasible for Micro-EDM´s surface roughness separation, and the time of wavelet decomposition is determined by Pearson Chi-square goodness of fit test. Furthermore, the results of simulation and experiments show that the proposed methods can separate the roughness of Micro-EDM and improve some arbitrary defects that the time of wavelet decomposition is determined by the cutoff wavelength and sampling interval, meanwhile, using the mean and variance of ideal surface as accuracy requirements of the reference line data could help the separation have a certain certainty and precision.
Keywords :
electrical discharge machining; micromachining; surface roughness; time-frequency analysis; wavelet transforms; Pearson Chi-square goodness; cutoff wavelength; fit test; microEDM; microelectrical discharge machining; multiresolution analysis; profile error; sampling interval; signal de-noising; surface contour lines; surface roughness; surface topography errors; surface waveness; time-frequency localization properties; wavelet decomposition; wavelet transform; workpiece functions; workpiece performances; Frequency; Machining; Rough surfaces; Surface discharges; Surface fitting; Surface roughness; Surface topography; Surface waves; Testing; Wavelet analysis; Micro-EDM; Pearson Chi-square goodness of fit test; Wavelet Analysis; roughness;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Information and Automation (ICIA), 2010 IEEE International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-5701-4
Type :
conf
DOI :
10.1109/ICINFA.2010.5512042
Filename :
5512042
Link To Document :
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