Title :
Heat analysis on insulated metal substrates [power electronics]
Author :
Yonemura, Naomi ; Fukuda, Makoto ; Shigi, Tadasuke
Author_Institution :
Sect. of Res. & Dev., HITT, Gumma, Japan
Abstract :
Applications of insulated metal substrates (IMS) for high-density and high-power mounting are rapidly extending with the miniaturization of electronic devices. The recent progress in insulation reliability and thermal conductivity of IMS has been making applications as substitutes for alumina DBC substrates possible. However, customers and/or potential customers are not satisfied with performance of conventional IMS for high-powered applications and an improved IMS equipping higher thermal conductive insulating layers is desired to widen the applications for high-powered devices. The influence of materials of which the IMS consists, i.e. base metals, insulating layers and copper conductors, were analyzed theoretically using FEM, and experimental data measured with a temperature distribution measuring instrument “Thermoviewer” were compared with the analytical data. The influence of the materials have been clarified through the analysis. In addition, an alumina DBC substrate and “GPS”, which is a special IMS developed newly for large-current and high-powered devices, were also investigated comparatively by simulation and experiments
Keywords :
MIM devices; circuit analysis computing; integrated circuit measurement; integrated circuit modelling; integrated circuit testing; power integrated circuits; power transistors; semiconductor device models; semiconductor device testing; software packages; substrates; thermal analysis; thermal conductivity; ANSYS software; FEM; Thermoviewer instrument; base metals; computer simulation; copper conductors; heat analysis; insulated metal substrates; insulation reliability; miniaturization; power electronics; temperature distribution measurement; thermal conductivity; Conducting materials; Copper; Data analysis; Inorganic materials; Instruments; Insulation; Power electronics; Temperature distribution; Temperature measurement; Thermal conductivity;
Conference_Titel :
Industry Applications Conference, 1996. Thirty-First IAS Annual Meeting, IAS '96., Conference Record of the 1996 IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-3544-9
DOI :
10.1109/IAS.1996.559249
