Title :
Comparison Research between XY and Odd-Even Routing Algorithm of a 2-Dimension 3X3 Mesh Topology Network-on-Chip
Author :
Zhang, Wang ; Hou, Ligang ; Wang, Jinhui ; Geng, Shuqin ; Wu, Wuchen
Author_Institution :
VLSI & Syst. Lab., Beijing Univ. of Technol., Beijing, China
Abstract :
The network-on-chip (NoC) has been recognized as a paradigm to solve system-on-chip (SoC) design challenges. The routing algorithm is one of key researches of a NoC design. XY routing algorithm, which is a kind of distributed deterministic routing algorithms, is simple to be implemented. Odd-even (OE) routing algorithm, whose implementation is complex, is a sort of distributed adaptive routing algorithms with deadlock-free ability. We demonstrate the two routing algorithms in details at first. XY routing algorithm and OE routing algorithm are then simulated and compared based on a 3times3 mesh topology NoC with NIRGAM simulator. The simulation results show that OE routing algorithm, whose P parameter equals to 1.09, increases P parameter greatly as compared to XY routing algorithm, whose P parameter equals to 0.86, in a 2-dimension 3times3 mesh topology NoC, with constant bit rate (CBR) traffic condition of each tail.
Keywords :
network-on-chip; telecommunication network routing; telecommunication network topology; telecommunication traffic; NIRGAM simulator; XY routing algorithm; adaptive routing algorithms; constant bit rate traffic; deterministic routing algorithms; distributed routing algorithms; mesh topology; network-on-chip; odd-even routing algorithm; system-on-chip; Algorithm design and analysis; Communication switching; Network topology; Network-on-a-chip; Physical layer; Protocols; Routing; System-on-a-chip; Telecommunication network reliability; Telecommunication network topology; network-on-chip; odd-even routing algorithm; system-on-chip; xy routing algorithm;
Conference_Titel :
Intelligent Systems, 2009. GCIS '09. WRI Global Congress on
Conference_Location :
Xiamen
Print_ISBN :
978-0-7695-3571-5
DOI :
10.1109/GCIS.2009.110